摘要：微纳米科技的发展和器械的小型化对精细加工过程提出了更高的要求，深入理解微纳米的切削规律至关重要。本文运用分子动力学方法，对大尺寸的单晶及多晶铜进行了切削深度为0.1μm的计算模拟，并就切削过程中单晶和多晶内部微结构演化、温度及切削力变化进行了分析及对比。结果表明：多晶铜在切削过程中位错滑移集中在刀具前沿几个晶粒内，对未切削工件区域的影响较小，温度分布更为集中，切削力也略小于单晶。

关键词：分子动力学；纳米切削；位错滑移；切削力

中图分类号：TG50；TH142文献标志码：A

Nanometric Machining of Copper by Molecular Dynamics Simulation

Su Hao，Tang Xingling，Chen Cen

Abstract:The progress in microand nanotechnologies and miniaturized components requires a higher precision in fabrication，and it is important to well understand the physical mechanisms of nanomachining process.In this paper，large scale monocrystal and polycrystal copper cutting are studied by molecular dynamics，and the cutting depth is 0.1μm.With the temperature and the cutting force together，the evolution of microstructures in cutting monocrystalline and polycrystalline are analysed.The results show that dislocations slip in polycrystal grains near the front cutting tool and effect is smaller than monocrystalline cutting region，and leading to a more concentrated distribution of temperature and smaller cutting force.

Keywords:molecular dynamics；nanometric machining；dislocation slipping；cutting force