线速度对金刚石线锯及硅片表面质量的影响
2019-11-15
作者：郭俊文1，苏宇飞2
单位：1内蒙古中环光伏材料有限公司；2内蒙古呼和浩特供电局武川分局
摘要：运用ABAQUS有限元分析软件建立金刚石线切割单晶硅的二维模型，并进行了二维切割仿真。通过改变金刚石单颗磨粒的切削速度，分析了单晶硅材料在不连续切割过程的应力场、切削力及不同切削速度对硅材料损伤层的影响。
关键词：金刚石磨粒；二维切割；切削速度；硅材料
中图分类号：TG717；TH161文献标志码：ADOI：10.3969/j.issn.1000-7008.2019.11.015
Influence of Wire Speed on Diamond Wire Saw and Surface Quality of Silion Wafer
Guo Junwen，Su Yufei
Abstract:The model of twodimensional finite element analysis software ABAQUS is used to establish the diamond wire cutting of monocrystalline silicon，and a twodimensional cutting simulation is put forward.By changing the diamond single grain cutting speed，silicon material discontinuous cutting process of stress field is analyzed，cutting force and different cutting speed on the surface quality of silicon material influence are analyzed.
Keywords:diamond grit；two dimensional cutting；cutting speed；silicon materials