AgCuTi钎料对YG8硬质合金及PCBN的润湿性研究
2020-10-23
作者：刘云1，2，王杰1， 刘松2，陈姣姣2，段黎明2
单位：1四川大学；2成都工具研究所有限公司
摘要：AgCuTi钎料用于YG8硬质合金和PCBN的真空钎焊，其润湿性受母材、钎焊温度及保温时间的影响较大。在真空炉中进行AgCuTi钎料对YG8硬质合金及PCBN的润湿性研究。试验结果表明：AgCuTi钎料能够良好地润湿母材，且随着钎焊温度及保温时间的增加，润湿性越好；AgCuTi钎料对PCBN的润湿性优于对YG8硬质合金的润湿性，原因在于钎料与PCBN间元素扩散程度更高，且钎料中的Ti元素与BN发生了化学反应。
关键词：AgCuTi钎料；YG8硬质合金；PCBN；润湿性；钎焊温度；保温时间
中图分类号：TG454；TH162文献标志码：ADOI：10.3969/j.issn.1000-7008.2020.08.005
Study on Wettability of AgCuTi Solder to YG8 Cemented Carbide and PCBN
Liu Yun，Wang Jie，Liu Song，Chen Jiaojiao，Duan Liming
Abstract:AgCuTi solder is used for vacuum brazing of YG8 cemented carbide and PCBN.Its wettability is greatly affected by the base material，brazing temperature and holding time.In this paper，the wettability of AgCuTi solder to YG8 cemented carbide and PCBN is studied in the vacuum furnace.The test results show that，AgCuTi solder can wet the base material well，and with the increase of brazing temperature and holding time，the wettability of the solder becomes better，and the wettability of the solder to PCBN is better than that to YG8 cemented carbide，because the degree of element diffusion between the solder and PCBN is higher，and the Ti element in the solder has chemically reacted with BN.
Keywords:AgCuTi solder；YG8 cemented carbide；PCBN；wettability；brazing temperature；holding time